Specific Process Knowledge/Etch/Etching of Bulk Glass: Difference between revisions
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==Overview: Wet HF-etch of bulk glass== | |||
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! Fused silica | |||
! Borofloat glass | |||
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|'''General description''' | |||
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*40% pre-mixed HF | |||
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*40% pre-mixed HF | |||
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|'''Possible masking materials''' | |||
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*[[Specific Process Knowledge/Thin film deposition/Deposition of Silicon|LPCVD silicon]] (good adhesion and step coverage) | |||
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*[[Specific Process Knowledge/Thin film deposition/Deposition of Silicon|Sputtered silicon (Alcatel)]] (bad adhesion and step coverage) | |||
*We are testing other masks at the moment (ask BGE) | |||
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|'''Etch rate''' | |||
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*~700 nm/min (patterned silica, slow stirring) | |||
*~800 nm/min (non-patterned silica, slow stirring) | |||
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*~3.9 µm/min | |||
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|'''Uniformity''' | |||
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*~ 2% (slow stirring, horizontal wafer) | |||
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* | |||
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|'''Batch size''' | |||
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*1 wafers at a time | |||
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*1 wafer at a time | |||
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|'''Size of substrate''' | |||
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*4" wafers | |||
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*4" wafers | |||
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|'''Allowed materials''' | |||
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*No restrictions | |||
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*No restrictions | |||
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