Specific Process Knowledge/Etch/Etching of Silicon Oxide: Difference between revisions
| Line 229: | Line 229: | ||
*Silicon Oxynitride | *Silicon Oxynitride | ||
*Photoresist | *Photoresist | ||
*DUV resist | |||
*E-beam resist | *E-beam resist | ||
*Other metals if they cover less than 5% of the wafer area (ONLY RIE2!) | *Other metals if they cover less than 5% of the wafer area (ONLY RIE2!) | ||
| Line 238: | Line 239: | ||
*Silicon Oxynitride | *Silicon Oxynitride | ||
*Photoresist | *Photoresist | ||
* | *DUV resist | ||
*E-beam resist | |||
*Aluminium | *Aluminium | ||
*Chromium (try to avoid it) | *Chromium (try to avoid it) | ||