Specific Process Knowledge/Etch/Etching of Silicon: Difference between revisions
| Line 215: | Line 215: | ||
*Photoresist | *Photoresist | ||
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* | *Photo-, DUV- and e-beamresist | ||
*E-beam resist | *E-beam resist | ||
*Silicon Oxide | *Silicon Oxide | ||
| Line 223: | Line 223: | ||
*Other metals if they cover less than 5% of the wafer area (ONLY RIE2!) | *Other metals if they cover less than 5% of the wafer area (ONLY RIE2!) | ||
| | | | ||
* | *Photo-, DUV- and e-beamresist | ||
*Silicon Oxide | *Silicon Oxide | ||
*Silicon Nitride | *Silicon Nitride | ||
*Aluminium oxide | *Aluminium oxide | ||
| | | | ||
* | *Photo-, DUV- and e-beamresist | ||
*Silicon Oxide | *Silicon Oxide | ||
*Silicon Nitride | *Silicon Nitride | ||