Specific Process Knowledge/Thin film deposition/Deposition of Tin: Difference between revisions

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Tin can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
Tin can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.


Revision as of 10:31, 15 April 2013

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Tin can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.


E-beam evaporation (Alcatel)
Batch size
  • Up to 1x4" wafers
  • smaller pieces
Pre-clean RF Ar clean
Layer thickness 10Å to 1µm
Deposition rate 2Å/s to 15Å/s
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