Specific Process Knowledge/Etch/Etching of Silicon Nitride: Difference between revisions
| Line 134: | Line 134: | ||
*Anisotropic etch: vertical sidewalls | *Anisotropic etch: vertical sidewalls | ||
| | | | ||
* | *Anisotropic etch: vertical sidewalls | ||
*Deep etch | |||
| | | | ||
*Primarily for pure physical etch by sputtering with Ar-ions | *Primarily for pure physical etch by sputtering with Ar-ions | ||