Specific Process Knowledge/Wafer cleaning/RCA: Difference between revisions
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*The RCA1 contains: H<sub>2</sub>O, NH<sub>4</sub>OH and H<sub>2</sub>O<sub>2</sub> (5:1:1). It is used for removal of light organics, particles and metals. <br \> | *The RCA1 contains: H<sub>2</sub>O, NH<sub>4</sub>OH and H<sub>2</sub>O<sub>2</sub> (5:1:1). It is used for removal of light organics, particles and metals. <br \> | ||
*The RCA2 contains: H<sub>2</sub>O, HCl and H<sub>2</sub>O<sub>2</sub> (5:1:1). It is used for removal of alkalis, metal hydroxides, and residual metals. | *The RCA2 contains: H<sub>2</sub>O, HCl and H<sub>2</sub>O<sub>2</sub> (5:1:1). It is used for removal of alkalis, metal hydroxides, and residual metals. | ||
You can find the APV here http://d4.danchip.dtu.dk/#DokID=1916 | |||
===RCA procedure=== | ===RCA procedure=== | ||