Specific Process Knowledge/Etch/Etching of Silicon: Difference between revisions
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===Dry etches:=== | ===Dry etches:=== | ||
*[[/Si etch using RIE1 or RIE2| | *[[/Si etch using RIE1 or RIE2|Si etch using RIE1 or RIE2]] | ||
*[[/Si etch using ASE|ASE (Advanced Silicon Etch)]] | *[[/Si etch using ASE|Si etch using ASE (Advanced Silicon Etch)]] | ||
*[[Specific Process Knowledge/Etch/DRIE-Pegasus|DRIE-Pegasus (Silicon Etch)]] | *[[Specific Process Knowledge/Etch/DRIE-Pegasus|Si etch using DRIE-Pegasus (Silicon Etch)]] | ||
*[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] | *[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBE Si etch|Si etch using IBE/IBSD Ionfab 300]] | ||
==Compare the methodes for Si etching== | ==Compare the methodes for Si etching== | ||