Specific Process Knowledge/Etch/Etching of Silicon: Difference between revisions
| Line 319: | Line 319: | ||
*E-beam resist | *E-beam resist | ||
*Other metals if they cover less than 5% of the wafer area (ONLY RIE2!) | *Other metals if they cover less than 5% of the wafer area (ONLY RIE2!) | ||
*Quartz/fused silica | |||
| | | | ||
*Silicon | *Silicon | ||
| Line 327: | Line 328: | ||
*zep resist | *zep resist | ||
*Aluminium oxide | *Aluminium oxide | ||
*Quartz/fused silica | |||
| | | | ||
*Silicon | *Silicon | ||
| Line 335: | Line 337: | ||
*E-beam resist | *E-beam resist | ||
*Aluminium | *Aluminium | ||
*Quartz/fused silica | |||
| | | | ||
*Silicon | *Silicon | ||
*Photoresist/e-beam resist | |||
*PolySilicon | |||
** | *Silicon oxide | ||
** | *Silicon (oxy)nitride | ||
*Quartz | *Aluminium | ||
*Titanium | |||
*Chromium | |||
*Quartz/fused silica | |||
| | | | ||
* | * | ||