Specific Process Knowledge/Etch/Etching of Silicon: Difference between revisions

@@ Line 300: / Line 300: @@
 !'''Allowed materials'''
 |
-*Allowed material 1
+*Silicon
-*Allowed material 2
+*Silicon Oxide
+*Silicon Nitride
+*Silicon Oxynitride
+*Other materials (only in "Fumehood KOH")
 |
-*Allowed material 1
+*Silicon
-*Allowed material 2
+*Silicon Oxide
-*Allowed material 3
+*Silicon Nitride
+*Silicon Oxynitride
+*Photoresist
 |
-*Allowed material 1
+*Silicon
+*Silicon Oxide
+*Silicon Nitride
+*Silicon Oxynitride
+*Photoresist
+*E-beam resist
+*Other metals if they cover less than 5% of the wafer area (ONLY RIE2!)
 |
 *Allowed material 1