Jump to content

Specific Process Knowledge/Etch/Etching of Polymer: Difference between revisions

Line 101: Line 101:
!Substrate size
!Substrate size
|
|
*samples smaller than 100 mm wafers must be glued to a 100 mm wafer or placed in a reces on a 100 mm wafer.
*Samples smaller than 100 mm wafers must be glued to a 100 mm wafer or placed in a reces on a 100 mm wafer.
*<nowiki>#</nowiki>1 100 mm wafer
*<nowiki>#</nowiki>1 100 mm wafer
*<nowiki>#</nowiki>1 150 mm wafer (only when system is set up to 150mm wafers)  
*<nowiki>#</nowiki>1 150 mm wafer (only when system is set up for 150 mm wafers)  
|
|
*<nowiki>#</nowiki> small samples
*<nowiki>#</nowiki> small samples
Line 129: Line 129:
|
|
Silicon wafers with layers of  
Silicon wafers with layers of  
*silicon oxide or silicon (oxy)nitride
*Silicon oxide or silicon (oxy)nitride
*Photoresist/e-beam resist
*Photoresist/e-beam resist
*PolySilicon
*PolySilicon