Specific Process Knowledge/Etch/Etching of Polymer: Difference between revisions
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*Si,SiO2,Si3N4 | *Si,SiO2,Si3N4 | ||
*Glass | |||
*Metals (no Pb or Te) | *Metals (no Pb or Te) | ||
*Resists, polymers | *Resists, polymers | ||
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* | *Si,SiO2,Si3N4 | ||
* | *Glass | ||
*Resists, polymers | |||
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* | Silicon wafers with layers of | ||
* | *silicon oxide or silicon (oxy)nitride | ||
*Photoresist/e-beam resist | |||
*PolySilicon | |||
*Metals(no Pb and Te) max 5% wafer coverage | |||
*Polymers (list?) | |||
Quartz/fused silica wafers | |||
Polymer wafers (only with special allowance) | |||
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* | *Any material the may go into the beaker used. | ||
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