Specific Process Knowledge/Etch/Etching of Polymer: Difference between revisions
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image:ASEpolymerEtching-cytop3.jpg| Profile | image:ASEpolymerEtching-cytop3.jpg| Profile | ||
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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=/... click here]''' | |||
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== Name of process == | |||
Write a short description of the process and how to perform the process. | |||
*[[/Deposition of silicon nitride using LPCVD|Process description using method 1]] | |||
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*[[/Deposition of silicon nitride using LPCVD|Process description using method 2]] | |||
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==Comparison method 1 and method 2 for the process== | |||
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! | |||
![[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride|Method 1]] | |||
![[Specific Process Knowledge/Thin film deposition/PECVD|Method 2]] | |||
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!Generel description | |||
|Generel description - method 1 | |||
|Generel description - method 2 | |||
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|-style="background:LightGrey; color:black" | |||
!Parameter 1 | |||
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*A | |||
*B | |||
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*A | |||
*B | |||
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!Parameter 2 | |||
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*A | |||
*B | |||
*C | |||
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*A | |||
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!Substrate size | |||
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*<nowiki>#</nowiki> small samples | |||
*<nowiki>#</nowiki> 50 mm wafers | |||
*<nowiki>#</nowiki> 100 mm wafers | |||
*<nowiki>#</nowiki> 150 mm wafers | |||
| | |||
*<nowiki>#</nowiki> small samples | |||
*<nowiki>#</nowiki> 50 mm wafers | |||
*<nowiki>#</nowiki> 100 mm wafers | |||
*<nowiki>#</nowiki> 150 mm wafers | |||
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!'''Allowed materials''' | |||
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*Allowed material 1 | |||
*Allowed material 2 | |||
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*Allowed material 1 | |||
*Allowed material 2 | |||
*Allowed material 3 | |||
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