Specific Process Knowledge/Etch/Etching of Gold: Difference between revisions
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*Anisotropic (angles sidewalls, typical around 70 dg) | *Anisotropic (angles sidewalls, typical around 70 dg) | ||
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|-style="background:WhiteSmoke; color:black" | |||
!Masking material | |||
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*Photoresist | |||
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*None (only used for stipping Au) | |||
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*Any material that is allowed in the chamber, photoresists included | |||
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