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Specific Process Knowledge/Etch/Etching of Gold: Difference between revisions

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Bureaucrats, danchip, Administrators
2,908 edits
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|-style="background:silver; color:black"
|-style="background:silver; color:black"
!
!
![[Specific Process Knowledge/Etch/Wet Aluminium Etch|Al wet etch 1]]
![[Specific Process Knowledge/Etch/Wet Gold Etch|Au wet etch 1]]
![[Specific Process Knowledge/Etch/Wet Aluminium Etch|Al wet etch 2]]
![[Specific Process Knowledge/Etch/Wet Gold Etch|Au wet etch 2]]
![[Specific_Process_Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE (Ionfab300+)]]
![[Specific_Process_Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE (Ionfab300+)]]
|-
|-
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Generel description
!Generel description
|Wet etch of pure Al
|Wet etch of Au using Iodine based chemistry
|Wet etch of Al + 1.5% Si
|Wet etch of Au using Aqua Regina
|Sputtering of Al - pure physical etch
|Sputtering of Au - pure physical etch
|-
|-


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!Etch rate range
!Etch rate range
|
|
*~100nm/min (pure Al)
*~100nm/min
|
|
*~60nm/min (Al+1.5% Si)
*~?nm/min - fast etch
|
|
*~30nm/min (not tested yet)  
*~30nm/min (not tested yet)  
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