Specific Process Knowledge/Thermal Process/BCB Curing Oven: Difference between revisions
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== Process information == | == Process information == | ||
There are | Here are some of the standard processes used in the BCB Curing Oven. | ||
=BCB curing:= | |||
The AL/BL processes are (should be) identical except for a (2x) pump/purge cycle in the beginning of the BL processes. | |||
* Long curing at 210°C: BCB210AL.PDF/[[Media:BCB210BL.PDF]] | |||
* Long curing at 250°C: BCB250AL.PDF/[[Media:BCB250BL.PDF]] | |||
=General processes= | |||
There are a number of general processes named DxxxCyyy.PDF. | |||
The Dxxx is the set temperature (in °C) and the Cyyy is the time (in minutes) at the set temperature. | |||
The oven heats to the set temperature (xxx) in 5 mins and then stays at the temperature (xxx) for a time (yyy) after which it cools to romm temperature as fast as possible. | |||
The program sequence looks like this for the file D200C060.PDF: | |||
; | |||
; stored 31.08.2011 at 18:15:47 | |||
{P0} | |||
00,05:00,0200,H - - 2 - - - - -,075,250,001,005,028 | |||
01,60:00,0200,H C 1 - - - - - - | |||
02,05:00,0002,- C 1 - - - - - - | |||
03,00:00,0000,- C - - - - - - - | |||
==Equipment performance and process related parameters== | ==Equipment performance and process related parameters== | ||