Specific Process Knowledge/Etch/Etching of Chromium: Difference between revisions
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!Generel description | !Generel description | ||
|Wet etch of Cr premixed (Chrome etch 18) | |||
|Wet etch of Cr that you need to mix your self | |Wet etch of Cr that you need to mix your self | ||
|Dry plasma etch of Cr | |Dry plasma etch of Cr | ||
|Sputtering of Cr - pure physical etch | |Sputtering of Cr - pure physical etch | ||
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!Etch rate range | !Etch rate range | ||
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*~?nm/min | |||
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*~40-100nm/min | *~40-100nm/min | ||
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*~14 nm/min (depending on features size and etch load) | *~14 nm/min (depending on features size and etch load) |
Revision as of 12:56, 21 March 2013
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Etching of Chromium
Etching of chromium can be done either by wet etch, dry etch or by sputtering with ions.
Comparison of Chromium Etch Metodes
Cr wet etch 1 | Cr wet etch 2 | ICP metal | IBE (Ionfab300+) | |
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Generel description | Wet etch of Cr premixed (Chrome etch 18) | Wet etch of Cr that you need to mix your self | Dry plasma etch of Cr | Sputtering of Cr - pure physical etch |
Etch rate range |
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Etch profile |
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Substrate size |
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Smaller pieces glued to carrier wafer
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Allowed materials |
No restrictions cross contamination wise as long as you use the right beaker and make sure that they are safe to enter in the chemicals |
No restrictions cross contamination wise as long as you use the right beaker and make sure that they are safe to enter in the chemicals |
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