Specific Process Knowledge/Etch/Wet Chromium Etch: Difference between revisions
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| '''Link to APV/KBA''' | | '''Link to APV/KBA''' | ||
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[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here] | [http://www.labmanager.danchip.dtu.dk/d4Show.php?id=2479&mach=146 see APV here] | ||
[http://kemibrug.dk/KBA/CAS/107388/?show_KBA=1&portaldesign=1 see KBA here] | [http://kemibrug.dk/KBA/CAS/107388/?show_KBA=1&portaldesign=1 see KBA here] | ||
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Revision as of 11:38, 21 March 2013
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Wet etching of Chromium
Wet etching of chromium at Danchip is done making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4. We have two solution for this:
- Commercial chromium etch
- HNO3:H2O:cerisulphate - 90ml:1200ml:15g - standard at Danchip
Etch rate are depending on the level of oxidation of the metal.
How to mix the Chromium etch 2:
- Take a beaker and add 15g of cerisulphate.
- Add a little water while stirring - make sure all lumps are gone.
- Add water until 600 ml - keep stirring (use magnetic stirring)
- Add 90 ml HNO3
- When the cerisulphate is completely dissolved (clear liquid) you can add the other 600 ml of wafer.
Overview of the data for the chromium etches
Chromium etch 1 | Chromium etch 2 | |
---|---|---|
General description |
Etch of chromium |
Etch of chromium |
Link to APV/KBA | ||
Chemical solution | Chrome ETCH 18 | HNO3:H2O:cerisulphate - 90ml:1200ml:15g |
Process temperature | Room temperature | Room Temperature |
Possible masking materials | Photoresist (1.5 µm AZ5214E) | Photoresist (1.5 µm AZ5214E) |
Etch rate | ~40-100 nm/min | . |
Batch size | 1-7 wafers at a time | 1-7 wafers at a time |
Size of substrate | 4" wafers | 4" wafers |
Allowed materials | No restrictions.
Make a note on the beaker of which materials have been processed. |
No restrictions.
Make a note on the beaker of which materials have been processed. |