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Specific Process Knowledge/Thin film deposition/Deposition of Palladium: Difference between revisions

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'''Feedback to this page''': '''[mailto:pvd@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Palladium&action=editclick here]'''
Palladium can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
Palladium can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.


Revision as of 15:11, 15 March 2013

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Palladium can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.


E-beam evaporation (Alcatel)
Batch size
  • Up to 1x4" wafers
  • smaller pieces
Pre-clean RF Ar clean
Layer thickness 10Å to 1µm
Deposition rate 2Å/s to 15Å/s
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