Jump to content

Specific Process Knowledge/Etch/Etching of Titanium: Difference between revisions

BGE (talk | contribs)
BGE (talk | contribs)
Line 120: Line 120:


Ething of Titanium can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done either with [[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP]] using Chlorine chemistry or with [[Specific Process Knowledge/Etch/IBE/IBSD Ionfab 300|IBE]] by sputtering with Ar ions.
Ething of Titanium can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done either with [[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP]] using Chlorine chemistry or with [[Specific Process Knowledge/Etch/IBE/IBSD Ionfab 300|IBE]] by sputtering with Ar ions.
==Wet etching of Titanium==
[[Image:Fumehoodetch-chrom2.jpg|300x300px|thumb|Fume hood: positioned in cleanroom 2. <br />Wet Etch of Titanium can take place in this pp tank or in a beaker in this fume hood]]
We have two solutions for wet titanium etching:
 
# BHF
# Cold RCA1
Do it by making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4. BHF etching can also take place in the PP-etch bath in the fume hood in cleanroom 2.
===Comparing the two solutions===
{| border="1" cellspacing="0" cellpadding="4"
!
! width="200" | BHF
! width="200" | Cold RCA1
|-
|'''General description'''
| Etch of titanium with or without photoresist mask.
| Etch of titanium (as stripper or with eagle resist).
|-
|'''Chemical solution'''
|HF:NH<sub>4</sub>F 
|NH<sub>3</sub>OH:H<sub>2</sub>O<sub>2</sub>:H<sub>2</sub>O - 1:1:5
|-
|'''Process temperature'''
|Room temperature
|Room temperature
|-
|'''Possible masking materials'''
|
Photoresist (1.5 µm AZ5214E)
|
Eagle resist
|-
|'''Etch rate'''
|
Not known (it bubbles while etching)
|
Not known
|-
|'''Batch size'''
|
1-5 4" in beaker
1-25 wafers at a time in PP-etch bath
|
1-5 4" wafer at a time
|-
|'''Etch bath'''
|Beaker or PP-etch bath in the fume hood in cleanroom 2.
|Beaker
|-
|'''Allowed materials'''
|
No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2.
Make a note on the beaker of which materials have been processed.
|
No restrictions when used in beaker.
Make a note on the beaker of which materials have been processed.
|-
|}


== Dry etching of titanium ==
== Dry etching of titanium ==


See the [[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP Metal Etch]] page.
See the [[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP Metal Etch]] page.