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Specific Process Knowledge/Etch/Etching of Titanium: Difference between revisions

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BGE (talk | contribs)
Bureaucrats, danchip, Administrators
2,908 edits
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|-style="background:silver; color:black"
|-style="background:silver; color:black"
!
!
![[Specific Process Knowledge/Etch/Wet Chromium Etch|Cr wet etch 1]]
![[Specific Process Knowledge/Etch/Wet Chromium Etch|Ti wet etch 1]]
![[Specific Process Knowledge/Etch/Wet Chromium Etch|Cr wet etch 2]]
![[Specific Process Knowledge/Etch/Wet Chromium Etch|Ti wet etch 2]]
![[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher|ICP metal]]
![[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher|ICP metal]]
![[Specific_Process_Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE (Ionfab300+)]]
![[Specific_Process_Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE (Ionfab300+)]]
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Generel description
!Generel description
|Wet etch of Cr that you need to mix your self
|BHF:Etch of titanium with or without photoresist mask.
|Wet etch of Cr premixed
|Etch of titanium (as stripper or with eagle resist).
|Dry plasma etch of Cr
|Dry plasma etch of Ti
|Sputtering of Cr - pure physical etch
|Sputtering of Ti - pure physical etch
|-
|-


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