Jump to content

Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions

Kn (talk | contribs)
No edit summary
Kn (talk | contribs)
No edit summary
Line 19: Line 19:
! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]])
! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]])
! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])


|-  
|-  
Line 71: Line 72:
|Dependent on [[/Sputter rates for Ag PVD co-sputter/evaporation|process parameters]].
|Dependent on [[/Sputter rates for Ag PVD co-sputter/evaporation|process parameters]].
|Depending on process paramterers (see logbook)
|Depending on process paramterers (see logbook)
|-
|-style="background:WhiteSmoke; color:black"
! Comment
|
|Only very thin layers.
|Only very thin layers (up to 100nm).
|
|
|-
|-
|}
|}