Specific Process Knowledge/Thin film deposition/Deposition of Platinum: Difference between revisions

From LabAdviser
Kn (talk | contribs)
No edit summary
Kn (talk | contribs)
No edit summary
Line 1: Line 1:
'''Feedback to this page''': '''[mailto:pvd@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Platinum click here]'''
==Platinum deposition ==
Platinum can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
Platinum can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.



Revision as of 14:08, 4 March 2013

Feedback to this page: click here


Platinum deposition

Platinum can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.


E-beam evaporation (Alcatel) E-beam evaporation (Wordentec)
Batch size
  • Up to 1x4" wafers
  • smaller pieces
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
Pre-clean RF Ar clean RF Ar clean
Layer thickness 10Å to 5000Å 10Å to 5000Å
Deposition rate 2Å/s to 15Å/s 10Å/s to 15Å/s