Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
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{| border="1" cellspacing="0" cellpadding="4" | {| border="1" cellspacing="0" cellpadding="4" | ||
|-style="background:silver; color:black" | |||
! | ! | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
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|-style="background:WhiteSmoke; color:black" | |||
! Batch size | ! Batch size | ||
| | | | ||
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*24x2" wafers | *24x2" wafers | ||
|- | |- | ||
|-style="background:LightGrey; color:black" | |||
! Pre-clean | ! Pre-clean | ||
|RF Ar clean | |RF Ar clean | ||
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|- | |- | ||
|-style="background:WhiteSmoke; color:black" | |||
! Layer thickness | ! Layer thickness | ||
|10Å to 1µm | |10Å to 1µm | ||
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|10Å to about 3000Å | |10Å to about 3000Å | ||
|- | |- | ||
|-style="background:LightGrey; color:black" | |||
! Deposition rate | ! Deposition rate | ||
|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||