Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
No edit summary |
No edit summary |
||
| Line 1: | Line 1: | ||
Silver can be deposited by e-beam | |||
'''Feedback to this page''': '''[mailto:pvd@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Aluminium click here]''' | |||
<!-- Replace "http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thin film deposition/Deposition of Aluminium" with the link to the Labadviser page--> | |||
<br clear="all" /> | |||
== Deposition of Silver == | |||
Silver can be deposited by e-beam evaporation, by sputtering and by thermal evaporation. In the chart below you can compare the different methods on the different deposition equipment. | |||
| Line 11: | Line 19: | ||
|- | |- | ||
! Batch size | |||
| | | | ||
*Up to 1x4" wafers | *Up to 1x4" wafers | ||
| Line 33: | Line 41: | ||
*24x2" wafers | *24x2" wafers | ||
|- | |- | ||
! Pre-clean | |||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
| Line 41: | Line 49: | ||
|- | |- | ||
! Layer thickness | |||
|10Å to 1µm | |10Å to 1µm | ||
|10Å to 0.5µm (0.5µm not on all wafers) | |10Å to 0.5µm (0.5µm not on all wafers) | ||
| Line 48: | Line 56: | ||
|10Å to about 3000Å | |10Å to about 3000Å | ||
|- | |- | ||
! Deposition rate | |||
|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
|1Å/s to 10 Å/s | |1Å/s to 10 Å/s | ||