Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
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Silver can be deposited by e-beam | |||
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== Deposition of Silver == | |||
Silver can be deposited by e-beam evaporation, by sputtering and by thermal evaporation. In the chart below you can compare the different methods on the different deposition equipment. | |||
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! Batch size | |||
| | | | ||
*Up to 1x4" wafers | *Up to 1x4" wafers | ||
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*24x2" wafers | *24x2" wafers | ||
|- | |- | ||
! Pre-clean | |||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
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|- | |- | ||
! Layer thickness | |||
|10Å to 1µm | |10Å to 1µm | ||
|10Å to 0.5µm (0.5µm not on all wafers) | |10Å to 0.5µm (0.5µm not on all wafers) | ||
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|10Å to about 3000Å | |10Å to about 3000Å | ||
|- | |- | ||
! Deposition rate | |||
|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
|1Å/s to 10 Å/s | |1Å/s to 10 Å/s | ||
Revision as of 11:36, 1 March 2013
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Deposition of Silver
Silver can be deposited by e-beam evaporation, by sputtering and by thermal evaporation. In the chart below you can compare the different methods on the different deposition equipment.
| E-beam evaporation (Alcatel) | Thermal evaporation (Wordentec) | E-beam evaporation (PVD co-sputter/evaporation) | Sputter evaporation (PVD co-sputter/evaporation) | Sputter evaporation (Wordentec) | |
|---|---|---|---|---|---|
| Batch size |
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| Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 0.5µm (0.5µm not on all wafers) | 10Å to 1000Å | 10Å to about 5000Å | 10Å to about 3000Å |
| Deposition rate | 2Å/s to 15Å/s | 1Å/s to 10 Å/s | About 1Å/s | Dependent on process parameters. | Depending on process paramterers (see logbook) |
Thermal deposition of Silver - Process settings for thermal deposition of Silver in Wordentec