Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
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! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | ||
! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | |||
! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
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*12x4" wafers or | *12x4" wafers or | ||
*12x2" wafers | *12x2" wafers | ||
| | |||
*4x6" wafers or | |||
*12x4" wafers or | |||
*12x2" wafers | |||
| | | | ||
*6x6" wafers or | *6x6" wafers or | ||
| Line 32: | Line 38: | ||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |||
|- | |- | ||
| Layer thickness | | Layer thickness | ||
| Line 37: | Line 45: | ||
|10Å to 0.5µm (0.5µm not on all wafers) | |10Å to 0.5µm (0.5µm not on all wafers) | ||
|10Å to 1000Å | |10Å to 1000Å | ||
|10Å to about | |10Å to about 5000Å | ||
|10Å to about 3000Å | |||
|- | |- | ||
| Deposition rate | | Deposition rate | ||
| Line 43: | Line 52: | ||
|1Å/s to 10 Å/s | |1Å/s to 10 Å/s | ||
|About 1Å/s | |About 1Å/s | ||
|Depending on process paramterers | |||
|Depending on process paramterers (see logbook) | |Depending on process paramterers (see logbook) | ||
|- | |- | ||