Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF): Difference between revisions
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BHF-bath in cleanroom 4: | BHF-bath in cleanroom 4: | ||
*1-25 wafers of 4" or 6" at a time | *1-25 wafers of 4" or 6" at a time | ||
RCA bench: | BHF-bath in RCA bench: | ||
*1-25 wafers of 4" or 6" at a time | *1-25 wafers of 4" or 6" at a time | ||
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PP-bath: | PP-bath: | ||
*1-25 wafers of 4" at a time | *1-25 wafers of 4" at a time | ||
RCA bench: | BHF-bath in RCA bench: | ||
*1-25 wafers of 4" or 6" at a time | *1-25 wafers of 4" or 6" at a time | ||
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