Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF): Difference between revisions
| Line 96: | Line 96: | ||
PP-bath: | PP-bath: | ||
*1-25 wafers of 4" at a time | *1-25 wafers of 4" at a time | ||
BHF-bath in | BHF-bath in cleanroom 3: | ||
*1-25 wafers of 4" at a time | *1-25 wafers of 4" at a time | ||
BHF-bath in cleanroom 4: | |||
*1-25 wafers of 4" or 6" at a time | |||
RCA bench: | |||
*1-25 wafers of 4" or 6" at a time | |||
| | | | ||
Plastic beaker: | Plastic beaker: | ||
| Line 104: | Line 108: | ||
*1-25 wafers of 4" at a time | *1-25 wafers of 4" at a time | ||
RCA bench: | RCA bench: | ||
*1-25 wafers of 4" at a time | *1-25 wafers of 4" or 6" at a time | ||
| | | | ||
1-7 wafer of 4" at a time | 1-7 wafer of 4" at a time | ||