Specific Process Knowledge/Lithography: Difference between revisions
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* 150 mm wafers | *150 mm wafers | ||
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* | *small samples | ||
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* | *150 mm wafers | ||
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* | *Cover slides | ||
* | *50 mm wafers | ||
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* | *IBIDI | ||
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Revision as of 16:34, 4 February 2013
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Available lithography methods at Danchip
There are a broad varity of lithography methods at Danchip. The methods are compared here to make it easier for you to compare and choose the one that suits your needs.
Comparing lithography methods at Danchip
Photolithography | DUV Lithography | E-beam Lithography | Imprint Lithography | Two photon polymerization Lithography | |
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Generel description | Generel description - method 1 | Generel description - method 2 | 3 | 4 | 5 |
Pattern size range |
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Resist type |
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Resist thickness range |
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Typical exposure time |
2s-30s pr. wafer |
?-? pr. ? |
Depends on dose (in units of muC/cm2), estimate exposure time on sheet 2 of e-beam logbook |
? pr. wafer |
? pr. µm2 |
Substrate size |
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We have cassettes that fit to
Only one cassette can be loaded at time |
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Allowed materials |
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