Specific Process Knowledge/Etch/DRIE-Pegasus/processA: Difference between revisions

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	The etching of silicon releases energy. This means that the faster the etch is, the more heat needs to be dissipated. ~~Similarly,~~ the larger a percentage of the wafer is etched~~, the more heat must be dissipated~~. Process A is the fastest etch and as seen above, the exposed area also plays an important role. ~~The~~		The etching of silicon releases energy. This means that the faster the etch is, the more heat needs to be dissipated. The consequence is the same if a larger percentage of the wafer is etched. Process A is the fastest etch and as seen above, the exposed area also plays an important role. Above 10 % exposed area the oxide mask erodes quickly.