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Specific Process Knowledge/Etch/Etching of Silicon: Difference between revisions

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There are a broad varity of silicon etch methodes at Danchip. The methodes are compared here to make it easier for you to compare and choose the one that suits your needs.  
There are a broad varity of silicon etch methodes at Danchip. The methodes are compared here to make it easier for you to compare and choose the one that suits your needs.  


*[[/Deposition of silicon nitride using LPCVD|Process description using methode 1]]
===Wet etches:===
<!-- Link to the process info page in LabAdviser -->
*[[Specific Process Knowledge/Etch/KOH Etch|KOH Etch]]
*[[Specific Process Knowledge/Etch/Wet Polysilicon Etch|Wet PolySilicon etch]]


*[[/Deposition of silicon nitride using LPCVD|Process description using methode 2]]
===Dry etches:===
<!-- Link to the process info page in LabAvdiser -->
*[[/Si etch using RIE1 or RIE2|Dry etch using RIE1 or RIE2]]
*[[/Si etch using ASE|ASE (Advanced Silicon Etch)]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus|DRIE-Pegasus (Silicon Etch)]]
*[[Specific Process Knowledge/Etch/IBE/IBSD Ionfab 300|IBE/IBSD Ionfab 300]]


==Comparison methode 1 and methode 2 for the process==
==Comparison methode 1 and methode 2 for the process==
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