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Specific Process Knowledge/Etch/Etching of Silicon: Difference between revisions

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!Resist type
!Etch rate range
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*UV sensitive:
*Si(100) @80<sup>o</sup>C: 1.29+0.05 µm/min
**AZ
*Si(100) @70<sup>o</sup>C: ~0.7 µm/min
**SU8
*Si(100) @60<sup>o</sup>C: ~0.4 µm/min
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*DUV sensitive
*~100-200 nm/min, highly dependent on doping level
**fff
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*E-beam sensitive
*<40nm/min to >600nm/min depending on recipe parameters and mask design
**ZEP502A (positive)
**HSQ (negative)
**SU8
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*Imprint polymers:
*Up to 18-20 µm/min depending on recipe, mask design and aspect ratio.
**??
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*?? sensitive:
*<130nm/min to >5.6 µm/min depending on recipe, mask design and aspect ratio.
**??
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