Specific Process Knowledge/Etch/DRIE-Pegasus/processA: Difference between revisions
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=== Results === | |||
<gallery caption="Optical images of the C01548 batch that is processed 10:05 mins." widths="250" heights="200" perrow="3"> | |||
image:C01548.01-A.jpg|Wafer C01548.01: 5 % exposed area | |||
image:C01548.02-A.jpg|Wafer C01548.02: 10 % exposed area | |||
image:C01548.03-A.jpg|Wafer C01548.01: 20 % exposed area | |||
image:C01548.04-A.jpg|Wafer C01548.01: 35 % exposed area | |||
image:C01548.05-A.jpg|Wafer C01548.01: 50 % exposed area | |||
</gallery> | |||