Specific Process Knowledge/Etch/Etching of Silicon: Difference between revisions

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-!Pattern size range
+!Possible masking materials
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-*~1µm and up
+*Silicon Nitride
+*Silicon Oxide
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-*~200nm and up
+*Photoresist
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-*~10nm and up
+*Photoresist
+*E-beam resist
+*Silicon Oxide
+*Silicon Nitride
+*Aluminium
+*Chromium (ONLY RIE2!)
+*Other metals if they cover less than 5% of the wafer area (ONLY RIE2!)
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-*~20nm and up
+*Photoresist and zep resist
+*Silicon Oxide
+*Silicon Nitride
+*Aluminium oxide
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-*3D ?nm
+*Photoresist
+*Silicon Oxide
+*Silicon Nitride
+*Aluminium
+|
+*Photo-, DUV- and e-beamresist
+*Silicon Oxide
+*Silicon Nitride
+*Aluminium
+*Cr
+*Ti
+|
+*Any material that is accepted in the machine
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