Specific Process Knowledge/Lithography: Difference between revisions
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*E-beam sensitive | *E-beam sensitive | ||
**ZEP502A | **ZEP502A (positive) | ||
**HSQ (negative) | |||
**SU8 | **SU8 | ||
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*~50nm to 2µm? | *~50nm to 2µm? | ||
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*~ | *~30nm to 0.5 µm | ||
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*~20nm to 10µm? | *~20nm to 10µm? | ||
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*<nowiki>#</nowiki> 150 mm wafers | *<nowiki>#</nowiki> 150 mm wafers | ||
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*<nowiki>#</nowiki> small samples | We have cassettes that fit to | ||
*<nowiki>#</nowiki> 50 mm | *<nowiki>#</nowiki> 4 small samples (20mm, 12mm, 8mm, 4mm) | ||
*<nowiki>#</nowiki> 100 mm | *<nowiki>#</nowiki> 6 wafers of 50 mm in size | ||
*<nowiki>#</nowiki> 150 mm | *<nowiki>#</nowiki> 2 wafers of 100 mm in size | ||
*<nowiki>#</nowiki> 1 wafer of 150 mm in size | |||
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*<nowiki>#</nowiki> small samples | *<nowiki>#</nowiki> small samples | ||
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*Allowed material 3 | *Allowed material 3 | ||
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* | *Si, SiO2, III-V materials | ||
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*Allowed material 1 | *Allowed material 1 |
Revision as of 09:53, 4 February 2013
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Comparing Lithography methodes at Danchip
There are a broad varity of lithography methodes at Danchip. The methodes are compared here to make it easier for you to compare and choose the one that suits your needs.
Comparison methode 1 and methode 2 for the process
Photolithography | DUV Lithography | E-beam Lithography | Imprint Lithography | Two photon polymerization Lithography | |
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Generel description | Generel description - methode 1 | Generel description - methode 2 | 3 | 4 | 5 |
Pattern size range |
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Resist type |
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Resist thickness range |
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Typical exposure time |
2s-30s pr. wafer |
?-? pr. ? |
?-? pr. µm2 |
? pr. wafer |
? pr. µm2 |
Substrate size |
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We have cassettes that fit to
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Allowed materials |
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