Specific Process Knowledge/Lithography: Difference between revisions

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!Parameter 2
!Resist type
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*A
*UV sensitive:
*B
**AZ
*C
**SU8
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*A
*DUV sensitive
**fff
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*3
*E-beam sensitive
**ZEP502A
**SU8
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*4
*Imprint polymers:
**??
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*5
*?? sensitive:
**??
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Revision as of 11:27, 1 February 2013

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Comparing Lithography methodes at Danchip

There are a broad varity of lithography methodes at Danchip. The methodes are compared here to make it easier for you to compare and choose the one that suits your needs.

Comparison methode 1 and methode 2 for the process

Photolithography DUV Lithography E-beam Lithography Imprint Lithograph Two photon polymetirzation Lithography
Generel description Generel description - methode 1 Generel description - methode 2 3 4 5
Pattern size range
  • ~1µm and up
  • ~200nm and up
  • ~20nm and up
  • ~20nm and up
  • 3D ?nm
Resist type
  • UV sensitive:
    • AZ
    • SU8
  • DUV sensitive
    • fff
  • E-beam sensitive
    • ZEP502A
    • SU8
  • Imprint polymers:
    • ??
  • ?? sensitive:
    • ??
Substrate size
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
Allowed materials
  • Allowed material 1
  • Allowed material 2
  • Allowed material 1
  • Allowed material 2
  • Allowed material 3
  • Allowed material 1
  • Allowed material 2
  • Allowed material 3
  • Allowed material 1
  • Allowed material 2
  • Allowed material 3
  • Allowed material 1
  • Allowed material 2
  • Allowed material 3