Specific Process Knowledge/Lithography: Difference between revisions

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![[Specific Process Knowledge/Thin film deposition/PECVD|E-beam Lithography]]
![[Specific Process Knowledge/Thin film deposition/PECVD|E-beam Lithography]]
![[Specific Process Knowledge/Thin film deposition/PECVD|Imprint Lithograph]]
![[Specific Process Knowledge/Thin film deposition/PECVD|Imprint Lithograph]]
![[Specific Process Knowledge/Thin film deposition/PECVD|Two photon Lithography]]
![[Specific Process Knowledge/Thin film deposition/PECVD|Two photon polymetirzation Lithography]]


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Revision as of 10:50, 1 February 2013

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Comparing Lithography methodes at Danchip

There are a broad varity of lithography methodes at Danchip. The methodes are compared here to make it easier for you to compare and choose the one that suits your needs.

Comparison methode 1 and methode 2 for the process

Photolithography DUV Lithography E-beam Lithography Imprint Lithograph Two photon polymetirzation Lithography
Generel description Generel description - methode 1 Generel description - methode 2 3 4 5
Parameter 1
  • A
  • B
  • A
  • B
  • A
  • B
  • A
  • B
  • A
  • B
Parameter 2
  • A
  • B
  • C
  • A
  • 3
  • 4
  • 5
Substrate size
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
Allowed materials
  • Allowed material 1
  • Allowed material 2
  • Allowed material 1
  • Allowed material 2
  • Allowed material 3
  • Allowed material 1
  • Allowed material 2
  • Allowed material 3
  • Allowed material 1
  • Allowed material 2
  • Allowed material 3
  • Allowed material 1
  • Allowed material 2
  • Allowed material 3