Specific Process Knowledge/Lithography: Difference between revisions
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![[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride| | ![[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride|Photolithography]] | ||
![[Specific Process Knowledge/Thin film deposition/PECVD| | ![[Specific Process Knowledge/Thin film deposition/PECVD|DUV Lithography]] | ||
![[Specific Process Knowledge/Thin film deposition/PECVD|E-beam Lithography]] | |||
![[Specific Process Knowledge/Thin film deposition/PECVD|Imprint Lithograph]] | |||
![[Specific Process Knowledge/Thin film deposition/PECVD|Two photon Lithography]] | |||
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*<nowiki>#</nowiki> small samples | |||
*<nowiki>#</nowiki> 50 mm wafers | |||
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Revision as of 10:38, 31 January 2013
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Comparing Lithography methodes at Danchip
There are a broad varity of lithography methodes at Danchip. The methodes are compared here to make it easier for you to compare and choose the one that suits your needs.
Comparison methode 1 and methode 2 for the process
Photolithography | DUV Lithography | E-beam Lithography | Imprint Lithograph | Two photon Lithography | |
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Generel description | Generel description - methode 1 | Generel description - methode 2 | 3 | 4 | 5 |
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