Specific Process Knowledge/Lithography: Difference between revisions

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== Name of process ==
== Comparing Lithography methodes at Danchip ==


Write a short description of the process and how to perform the process.
There are a broad varity of lithography methodes at Danchip. The mothodes are compared here to make it easier for you to compare and choose the one that suits your needs.  


*[[/Deposition of silicon nitride using LPCVD|Process description using methode 1]]
*[[/Deposition of silicon nitride using LPCVD|Process description using methode 1]]

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Comparing Lithography methodes at Danchip

There are a broad varity of lithography methodes at Danchip. The mothodes are compared here to make it easier for you to compare and choose the one that suits your needs.

Comparison methode 1 and methode 2 for the process

Methode 1 Methode 2
Generel description Generel description - methode 1 Generel description - methode 2
Parameter 1
  • A
  • B
  • A
  • B
Parameter 2
  • A
  • B
  • C
  • A
Substrate size
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
Allowed materials
  • Allowed material 1
  • Allowed material 2
  • Allowed material 1
  • Allowed material 2
  • Allowed material 3