Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch): Difference between revisions

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 The Bosch process uses alternation between an etch cycle and a passivation cycle. In the case of the silicon etching on the ASE, an etch phase with SF<sub>6</sub> and O<sub>2</sub> alternates with a passivation phase with C<sub>4</sub>F<sub>8</sub>.
-Two recipes have been optimized for the ASE:
+Two recipes have been optimized for the ASE. The specification is on a 10 % etch load wafer with trenches.
-* '''Shallolr'''
+* '''Shallolr''': The shallow etch process will etch a 2 <math>\mu</math>m feature down to 20 <math>\mu</math>m trench.
-This shallow etch process will produce a 20 <math>\mu</math>m
+* '''Deepetch''': The deep etch process will etch a 50 <math>\mu</math>m feature down to 300 <math>\mu</math>m trench.
-and a deep etch deepetch. They have been designed
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