Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch): Difference between revisions
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The Bosch process uses alternation between an etch cycle and a passivation cycle. In the case of the silicon etching on the ASE, an etch phase with SF<sub>6</sub> and O<sub>2</sub> alternates with a passivation phase with C<sub>4</sub>F<sub>8</sub>. | The Bosch process uses alternation between an etch cycle and a passivation cycle. In the case of the silicon etching on the ASE, an etch phase with SF<sub>6</sub> and O<sub>2</sub> alternates with a passivation phase with C<sub>4</sub>F<sub>8</sub>. | ||
Two recipes have been optimized for the ASE: | Two recipes have been optimized for the ASE: | ||
* '''Shallolr''' | |||
This shallow etch process will produce a 20 <math>\mu</math>m | |||
and a deep etch deepetch. They have been designed | |||
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| 5 s | | 5 s | ||
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