Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch): Difference between revisions
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==The Bosch process:== | ==The Bosch process:== | ||
The Bosch process uses alternation between an | The Bosch process uses alternation between an etch cycle and a passivation cycle. In the case of the silicon etching on the ASE, an etch phase with SF<sub>6</sub> and O<sub>2</sub> alternates with a passivation phase with C<sub>4</sub>F<sub>8</sub>. | ||
etch cycle and a passivation cycle. In the case of the silicon etching on the ASE, an etch phase with SF<sub>6</sub> and O<sub>2</sub> alternates with a passivation phase with C<sub>4</sub>F<sub>8</sub>. | |||
Two recipes have been optimized for the ASE: A shallow etch shallolr and a deep etch deepetch. | |||
=== Specifications of the standard ASE etches === | |||
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