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Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch): Difference between revisions

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Line 9: Line 9:
| Etch
| Etch
| Pass
| Pass
|-
|-
|-
| Temperature  
| Temperature  
Line 29: Line 28:
| 120 sccm
| 120 sccm
|-
|-
| APC mode
| manual
| Ar Flow
| 0 sccm
| 0 sccm
|-
| APC setting
| 86.8 %
| RF coil
| 2800 W
| 1000 W
|-
|}
|}


Line 55: Line 67:
Two recipes have been optimized for the ASE: A shallow etch shallolr and a deep etch
Two recipes have been optimized for the ASE: A shallow etch shallolr and a deep etch
deepetch.
deepetch.
{| border="1" cellspacing="1" cellpadding="2"  align="left"
|+'''Shallolr'''
|-
! Process
! Parameter
!! Phase
Etch
|-
| SF<sub>6</sub> flow
|32 sccm
|-
|O<sub>2</sub> flow
|8 sccm
|-
|Pressure
|80 mTorr
|-
|RF-power
|30 W
|-
|}
New process
{| border="1" cellpadding="5" cellspacing="10"
|-
! Column 1 || Column 2 || Column 3
|-
| rowspan="2"| A
| colspan="2" align="center"| B
|-
| C <!-- column 1 occupied by cell A -->
| D
|-
| E
| rowspan="2" colspan="2" align="center"| F
|-
| G <!-- column 2+3 occupied by cell F -->
|-
| colspan="3" align="center"| H
|}
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