Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF): Difference between revisions
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SIO etch (BHF with wetting agent) can also be used for etching silicon oxide. This is mainly for etching small holes. If you have wetting problems in BHF try the SIO etch. It is also a good idea to wet the sample in water for a few minutes before etching. | SIO etch (BHF with wetting agent) can also be used for etching silicon oxide. This is mainly for etching small holes. If you have wetting problems in BHF try the SIO etch. It is also a good idea to wet the sample in water for a few minutes before etching. | ||
Wafers with metals or other materials not allowed in the dedicated oxide etch baths | Wafers with metals or other materials, not allowed in the dedicated oxide etch baths, can be etched in the PP-bath positioned in the fume hood in cleanroom 2 or in a '''plastic''' beaker. | ||
===Silicon oxide etch data=== | ===Silicon oxide etch data=== | ||