Specific Process Knowledge/Etch/ICP Metal Etcher: Difference between revisions

@@ Line 41: / Line 41: @@
 |style="background:LightGrey; color:black"|Gas flows
 |style="background:WhiteSmoke; color:black"|
-*SF<sub>6</sub>: 0-100 sccm
+{|
-*O<sub>2</sub>: 0-100 sccm
+|*SF<sub>6</sub>: 0-100 sccm
-*C<sub>4</sub>F<sub>8</sub>: 0-100 sccm
+|*O<sub>2</sub>: 0-100 sccm
-*Ar: 0-100 sccm
+|*C<sub>4</sub>F<sub>8</sub>: 0-100 sccm
-*CF<sub>4</sub>: 0-100 sccm
+|*Ar: 0-100 sccm
-*H<sub>2</sub>: 0-30 sccm
+|*CF<sub>4</sub>: 0-100 sccm
-*CH<sub>4</sub>: 0-50 sccm
+|-
-*BCl<sub>3</sub>: 0-100 sccm
+|*H<sub>2</sub>: 0-30 sccm
-*Cl<sub>2</sub>: 0-100 sccm
+|*CH<sub>4</sub>: 0-50 sccm
-*HBr: 0-100 sccm
+|*BCl<sub>3</sub>: 0-100 sccm
+|*Cl<sub>2</sub>: 0-100 sccm
+|*HBr: 0-100 sccm
+|}
 |-
 !style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates