Specific Process Knowledge/Etch: Difference between revisions
| Line 18: | Line 18: | ||
*[[/Etching of Gold|Gold]] | *[[/Etching of Gold|Gold]] | ||
*[[/Etching of Platin|Platin]] | *[[/Etching of Platin|Platin]] | ||
*[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBE magnetic stack etch|Magnetic stack containing Ta/MnIr/NiFe etch]] | |||
*[[/Etching of Polymer|Polymer]] | *[[/Etching of Polymer|Polymer]] | ||
*[[/Etching of Silicon|Silicon]] | *[[/Etching of Silicon|Silicon]] | ||
| Line 23: | Line 24: | ||
*[[/Etching of Silicon Oxide|Silicon Oxide]] | *[[/Etching of Silicon Oxide|Silicon Oxide]] | ||
*[[/Etching of Bulk Glass|Bulk Glass]] - ''Borofloat (pyrex) and fused silica (quartz)'' | *[[/Etching of Bulk Glass|Bulk Glass]] - ''Borofloat (pyrex) and fused silica (quartz)'' | ||
== Choose a dry etch equipment == | == Choose a dry etch equipment == | ||