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Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions

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The user manual, quality control procedure and the results may all be found on the [http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=265| DRIE-Pegasus LabManager] page.
The user manual, quality control procedure and the results may all be found on the [http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=265| DRIE-Pegasus LabManager] page.
'''Important information'''
In August 2011 we introduced a new set of rules regarding the loading of wafers. In you were trained prior to this, you can find more information
[[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Waferloading|here]].
'''Acceptance test'''
The instrument was opened for users in April 2010 when the acceptance test was signed. This was based on the performance of five standard recipes (A, B, C, D and SOI) that are further examined below. The acceptance test report is found [[Media:Pegasus_AcceptanceTest.pdf|here]].


== Process information ==
== Process information ==