Specific Process Knowledge/Thermal Process/BCB Curing Oven: Difference between revisions

Revision as of 11:16, 3 December 2012

BCB Curing Oven

The BCB Curing Oven is mainly used for curing of BCB (bisbenzocyclobutene) and for alloying of metals in a nitrogen atmosphere.

During processing the furnace is rapidly heated by use of five halogen lamps situated below the sample. The furnace is purged with a high or a low nitrogen flow. Samples are processed at atmospheric pressure or at vacuum.

The user manual, user APV, technical information and contact information can be found in LabManager:

BCB Curing Oven

Process information

There are no standard processes on the furnace.

Equipment performance and process related parameters

Equipment		BCB Curing Oven
Purpose		BCB curing Metal alloying
Process parameter range	Temperature	22 - 450^oC
	Nitrogen flows	Low N₂ flow: 5 SLM High N₂ flow: Max 16.7 SLM
	Pressure	Atmospheric pressure or vacuum
Substrates (Remember to use the right carrier wafer)	Batch size	Several small samples One 50 mm wafer One 100 mm wafer
	Allowed materials	BCB III-V materials Co-polymer Silicon, silicon oxide, silicon nitride Quartz Resist (prebaked) Metal (only Al, Ni, Ge and Au)

@@ Line 32: / Line 32: @@
 |style="background:LightGrey; color:black"|Temperature
 |style="background:WhiteSmoke; color:black"|
-*0 - 450<sup>o</sup>C
+*22 - 450<sup>o</sup>C
 |-
 |style="background:LightGrey; color:black"|Nitrogen flows