Specific Process Knowledge/Thermal Process/BCB Curing Oven: Difference between revisions

@@ Line 26: / Line 26: @@
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-*BCB curing and metal alloying
+*BCB curing
+*Metal alloying
 |-
-!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
+!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameter range
 |style="background:LightGrey; color:black"|Temperature
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 *Low N<sub>2</sub> flow: 5 SLM
 *High N<sub>2</sub> flow: Max 16.7 SLM
+|-
+|style="background:LightGrey; color:black"|Pressure
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+*Atmospheric pressure or vacuum
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
+(Remember to use the right carrier wafer)
 |style="background:LightGrey; color:black"|Batch size
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-*Several small samples (placed on a carrier wafer)
+*Several small samples
-*One 50 mm wafer (placed on a carrier wafers)
+*One 50 mm wafer
 *One 100 mm wafer
 |-
 | style="background:LightGrey; color:black"|Allowed materials
-'''Use the right carrier wafer'''
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 *BCB