Specific Process Knowledge/Thermal Process/BCB Curing Oven: Difference between revisions
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | ||
|style="background:WhiteSmoke; color:black"|<b> | |style="background:WhiteSmoke; color:black"|<b>BCB Curing Oven</b> | ||
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!style="background:silver; color:black;" align="center"|Purpose | !style="background:silver; color:black;" align="center"|Purpose | ||
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*One 100 mm wafer | *One 100 mm wafer | ||
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| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||
'''Use the right carrier wafer''' | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*BCB | *BCB | ||
*III-V materials | |||
*Co-polymer | *Co-polymer | ||
*Silicon | *Silicon, silicon oxide, silicon nitride | ||
*Quartz | *Quartz | ||
*Resist (prebaked) | *Resist (prebaked) | ||
*Metal (only Al, Ni, Ge and Au) | |||
*Metal (only | |||
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|} | |} | ||