Specific Process Knowledge/Characterization: Difference between revisions
No edit summary |
|||
| Line 8: | Line 8: | ||
*[[Specific_Process_Knowledge/Characterization/Drop_Shape_Analyzer|Hydrophobicity measurement]] | *[[Specific_Process_Knowledge/Characterization/Drop_Shape_Analyzer|Hydrophobicity measurement]] | ||
*[[/Resistivity measurement|Resistivity measurement]] | *[[/Resistivity measurement|Resistivity measurement]] | ||
*[[Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy|Scanning Electron Microscopy]] | |||
<!-- | <!-- | ||
*[[/Other electrical measurements|Other electrical measurements]] | *[[/Other electrical measurements|Other electrical measurements]] | ||
--> | --> | ||
== Choose equipment == | == Choose equipment == | ||
Revision as of 12:02, 30 November 2012
Choose characterization topic (to find which tool to use)
- Sample imaging
- Topographic measurement
- Stress measurement
- Measurement of film thickness and optical constants
- Wafer thickness measurement
- Element analysis
- Hydrophobicity measurement
- Resistivity measurement
- Scanning Electron Microscopy